US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 6 for "Semiconductor structure and method for manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,970, issued on May 6, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method for manufacturing thereof" was invented by Shih-Hsiang Kao (Hsinchu, Taiwan) and Chi-Wen Chang (Changhua County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure is provided. The semiconductor structure includes a substrate and a metallization layer. The metallization layer is disposed over the substrate. The metallization layer includes a first signal line, a second signal line, and a third signal line, wherein the first signal line, the second signal line, and the third signal l...