US Patent Issued to Taiwan Semiconductor Manufacturing on May 6 for "Semiconductor package and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,988, issued on May 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and method of forming the same" was invented by Wei-Chih Chen (Taipei, Taiwan), Hung-Jui Kuo (Hsinchu, Taiwan), Yu-Hsiang Hu (Hsinchu, Taiwan), Sih-Hao Liao (New Taipei, Taiwan) and Hung-Chun Cho (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a semiconductor die and a redistribution structure. The semiconductor die is laterally surrounded by a molding compound, and the semiconductor die has a conductive pillar and a complex compound sheath sandwiched between the conductive pilla...