ALEXANDRIA, Va., June 10 -- United States Patent no. 12,294,028, issued on May 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Manufacturing method of semiconductor device" was invented by Jiun-Ming Kuo (Taipei, Taiwan), Hsin-Chih Chen (New Taipei, Taiwan), Che-Yuan Hsu (Hsinchu, Taiwan), Kuo-Chin Liu (Hualien County, Taiwan), Han-Yu Tsai (Hsinchu, Taiwan), You-Ting Lin (Miaoli County, Taiwan) and Jen-Hong Chang (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device includes at least the following steps. A protrusion is formed in a substrate by an anisotropic etch process, wherein a sidewall of the protrusion is incl...