US Patent Issued to Taiwan Semiconductor Manufacturing on May 6 for "Integrated circuit packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,985, issued on May 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit packages and methods of forming the same" was invented by Chih-Chia Hu (Taipei, Taiwan), Ming-Fa Chen (Taichung, Taiwan) and Sung-Feng Yeh (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are integrated circuit packages and methods of forming the same. An integrated circuit package includes an integrated circuit structure, a first die stack and a dummy die. The first die stack includes a plurality of first die structures and is bonded to the integrated circuit structure at a first side of the first die stack...