US Patent Issued to Taiwan Semiconductor Manufacturing on May 6 for "Integrated circuit package and method of forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,294,002, issued on May 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method of forming same" was invented by Shang-Yun Hou (Jubei, Taiwan), Sung-Hui Huang (Dongshan Township, Taiwan), Kuan-Yu Huang (Taipei, Taiwan), Hsien-Pin Hu (Zhubei, Taiwan), Yushun Lin (Taipei, Taiwan), Heh-Chang Huang (Hsinchu, Taiwan), Hsing-Kuo Hsia (Jhubei, Taiwan), Chih-Chieh Hung (Hsinchu, Taiwan), Ying-Ching Shih (Hsinchu, Taiwan), Chin-Fu Kao (Taipei, Taiwan), Wen-Hsin Wei (Hsinchu, Taiwan), Li-Chung Kuo (Taipei, Taiwan), Chi-Hsi Wu (Hsinchu, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Paten...