US Patent Issued to Taiwan Semiconductor Manufacturing on May 6 for "3D semiconductor package including memory array" (Taiwanese Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,999, issued on May 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"3D semiconductor package including memory array" was invented by Bo-Feng Young (Taipei, Taiwan), Sai-Hooi Yeong (Zhubei, Taiwan), Han-Jong Chia (Hsinchu, Taiwan), Sheng-Chen Wang (Hsinchu, Taiwan) and Yu-Ming Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Routing arrangements for 3D memory arrays and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a memory array including a gate dielectric layer contacting a first word line and a second word line; and an oxide semiconductor (OS) layer...