US Patent Issued to Taiwan Semiconductor Manufacturing on May 27 for "System and method for removing debris during chemical mechanical planarization" (Taiwanese Inventor)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,311,501, issued on May 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"System and method for removing debris during chemical mechanical planarization" was invented by Chun-Wei Hsu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chemical mechanical planarization system includes a chemical mechanical planarization pad that rotates during a chemical mechanical planarization process. A chemical mechanical planarization head places a semiconductor wafer in contact with the chemical mechanical planarization pad during the process. A slurry supply system supplies a slurry onto the pad during the process. A ...