US Patent Issued to Taiwan Semiconductor Manufacturing on May 27 for "Storage layers for wafer bonding" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,837, issued on May 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Storage layers for wafer bonding" was invented by De-Yang Chiou (Hsinchu, Taiwan), Yu-Yun Peng (Hsinchu, Taiwan), Fu-Ting Yen (Hsinchu, Taiwan) and Keng-Chu Lin (Pingtung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes a semiconductor structure having bonded wafers with storage layers and a method to bond wafers with storage layers. The semiconductor structure includes a first wafer including a first storage layer with carbon, a second wafer including a second storage layer with carbon, and a bonding layer in...