US Patent Issued to Taiwan Semiconductor Manufacturing on May 27 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,786, issued on May 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing method thereof" was invented by Ting-Yu Yeh (Hsinchu, Taiwan), Ching-He Chen (Taoyuan, Taiwan), Kuo-Chiang Ting (Hsinchu, Taiwan), Weiming Chris Chen (Taipei, Taiwan), Chia-Hao Hsu (Hsinchu, Taiwan), Kuan-Yu Huang (Taipei, Taiwan) and Shu-Chia Hsu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a solder resist layer disposed on a circuit substrate and partially covering contact pads of the circuit substrate, and external terminals disposed on the solder res...