US Patent Issued to Taiwan Semiconductor Manufacturing on May 27 for "Semiconductor package and manufacturing method of semiconductor package" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,655, issued on May 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and manufacturing method of semiconductor package" was invented by Ming-Fa Chen (Taichung, Taiwan), Hsien-Wei Chen (Hsinchu, Taiwan) and Jie Chen (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a semiconductor package includes the following steps. A photonic die is provided, wherein the photonic die includes an optical coupler. An electronic die is bonded over the photonic die. An encapsulating material is provided over the photonic die, wherein the encapsulating material at least l...