ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,517, issued on May 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor die package and methods of formation" was invented by Shu-Hui Su (Tucheng, Taiwan), Hsin-Li Cheng (Hsin Chu, Taiwan) and YingKit Felix Tsui (Cupertino, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die included in a semiconductor die package may include a plurality of decoupling trench capacitor regions in a device region of the semiconductor die. At least two or more of the decoupling trench capacitor regions include decoupling trench capacitor structures having different depths. The depths of the decoupling t...