US Patent Issued to Taiwan Semiconductor Manufacturing on May 27 for "Semiconductor devices including backside power rails and methods of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,551, issued on May 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices including backside power rails and methods of manufacture" was invented by Chun-Hung Wu (New Taipei, Taiwan), Chia-Ling Chung (Hsinchu, Taiwan), Su-Hao Liu (Jhongpu Township, Taiwan), Liang-Yin Chen (Hsinchu, Taiwan), Shun-Wu Lin (Hsinchu, Taiwan), Huicheng Chang (Tainan, Taiwan) and Yee-Chia Yeo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor device including performing an ion implantation on a substrate and etching the substrate and semiconductor devices formed by the same ...