US Patent Issued to Taiwan Semiconductor Manufacturing on May 27 for "Semiconductor devices and methods of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,556, issued on May 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of manufacture" was invented by Yen-Ting Chen (Taichung, Taiwan), Po-Shao Lin (Hsinchu, Taiwan) and Wei-Yang Lee (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices and methods of fabrication are described herein. The method includes steps for patterning fins in a multilayer stack and forming an opening in a fin and into a substrate as an initial step in forming a source/drain region. A first semiconductor material is epitaxially grown from channels exposed along sidewalls of the op...