US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 27 for "Semiconductor device with backside self-aligned power rail and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,542, issued on May 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Semiconductor device with backside self-aligned power rail and methods of forming the same" was invented by Chih-Chao Chou (Hsinchu, Taiwan), Kuo-Cheng Chiang (Hsinchu County, Taiwan), Shi Ning Ju (Hsinchu, Taiwan), Wen-Ting Lan (Hsinchu, Taiwan) and Chih-Hao Wang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor device and the manufacturing method thereof are disclosed. An exemplary semiconductor device comprises a dielectric layer formed over a conductive feature; a semiconductor stack formed over the dielectric...