US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 27 for "Semiconductor device structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,552, issued on May 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device structure and method for forming the same" was invented by Chien-Wei Lee (Kaohsiung, Taiwan), Yen-Ting Chen (Taichung, Taiwan), Wei-Yang Lee (Taipei, Taiwan) and Chia-Pin Lin (Xinpu Township, Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base and a fin structure over the base. The semiconductor device structure includes an isolation structure over the base and surrounding a lower portion of ...