ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,726, issued on May 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor device and method" was invented by Ching-Yu Chang (Taipei, Taiwan), Jung-Hau Shiu (New Taipei, Taiwan), Jen Hung Wang (Hsinchu, Taiwan) and Tze-Liang Lee (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing an integrated circuit includes patterning a plurality of photomask layers over a substrate, partially backfilling the patterned plurality of photomask layers with a first material using atomic layer deposition, completely backfilling the patterned plurality of photomask layers with a second mat...