ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,842, issued on May 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package structure" was invented by Hsien-Wei Chen (Hsinchu, Taiwan), Ming-Fa Chen (Taichung, Taiwan) and Sung-Feng Yeh (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes at least one semiconductor die, an insulating encapsulant, an isolation layer and a redistribution layer. The at least one first semiconductor die has a semiconductor substrate and a conductive post disposed on the semiconductor substrate. The insulating encapsulant is partially encapsulating the first semiconductor die, wherein the conducti...