US Patent Issued to Taiwan Semiconductor Manufacturing on May 27 for "Package assembly including lid with additional stress mitigating feet and methods of making the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,768, issued on May 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package assembly including lid with additional stress mitigating feet and methods of making the same" was invented by Yu-Sheng Lin (Zhubei, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan), Chin-Hua Wang (New Taipei, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan), Shin-Puu Jeng (Hsinchu, Taiwan), Chien Hung Chen (Taipei, Taiwan), Chia-Kuei Hsu (Hsinchu, Taiwan), Po-Chen Lai (Hsinchu, Taiwan) and Yu Chen Lee (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package assembly includes a package substrate, a package lid located on the package su...