US Patent Issued to Taiwan Semiconductor Manufacturing on May 27 for "Package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,772, issued on May 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package and manufacturing method thereof" was invented by Yung-Chi Chu (Kaohsiung, Taiwan), Hung-Jui Kuo (Hsinchu, Taiwan), Yu-Hsiang Hu (Hsinchu, Taiwan) and Sih-Hao Liao (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a die, an encapsulant, and a redistribution structure. The encapsulant laterally encapsulates the die. The redistribution structure is over the die and the encapsulant. The redistribution structure partially exposes the die. A top surface of the redistribution structure is slanted downward conti...