US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 27 for "Method for manufacturing semiconductor structure with isolation feature" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,540, issued on May 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method for manufacturing semiconductor structure with isolation feature" was invented by Shih-Cheng Chen (New Taipei, Taiwan), Zhi-Chang Lin (Zhubei, Taiwan), Jung-Hung Chang (Changhua County, Taiwan), Chien-Ning Yao (Hsinchu, Taiwan), Tsung-Han Chuang (Tainan, Taiwan) and Kuo-Cheng Chiang (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor structures and methods for manufacturing the same are provided. The semiconductor structure includes a substrate and a bottom isolation feature formed over the substrate. The semicon...