US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 27 for "Method for forming a semiconductor structure using dehydrating chemical, and method for forming a semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,576, issued on May 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method for forming a semiconductor structure using dehydrating chemical, and method for forming a semiconductor structure" was invented by Chung-Chieh Lee (Taipei, Taiwan), Chi-Ming Yang (Hsinchu, Taiwan) and Chyi Shyuan Chern (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a method for forming a semiconductor structure, including dispensing a dehydrating chemical over a fin of a substrate, wherein the dehydrating chemical includes a first chemical, and a second chemical having a melting point grea...