ALEXANDRIA, Va., June 17 -- United States Patent no. 12,313,675, issued on May 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Method and device for wafer-level testing" was invented by Jun He (Hsinchu, Taiwan), Yu-Ting Lin (Hsin-Chu, Taiwan), Wei-Hsun Lin (Hsinchu County, Taiwan), Yung-Liang Kuo (Hsinchu, Taiwan) and Yinlung Lu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a method and a system for testing semiconductor device. The system includes a signal generator and a module. The signal generator is configured to apply an initial signal to an input terminal of a DUT during a first period; and apply a stress signal ...