US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 27 for "Integrated circuit structure and method for manufacturing the same" (Taiwanese, American Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,861, issued on May 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit structure and method for manufacturing the same" was invented by Wei-Ling Chang (Hsinchu, Taiwan), Lee-Chung Lu (Taipei, Taiwan), Xiangdong Chen (San Diego), Kam-Tou Sio (Hsinchu County, Taiwan) and Hsiang-Chi Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit structure includes a first transistor, a second transistor, a first conductive via, a second conductive via, and a connection line. The first transistor includes a first active region, a first gate electrode over the first active...