US Patent Issued to Taiwan Semiconductor Manufacturing on May 27 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,854, issued on May 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Wei Ling Chang (Hsinchu, Taiwan), Chuei-Tang Wang (Taichung, Taiwan) and Chieh-Yen Chen (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a structure includes: a processor device including logic devices; a first memory device directly face-to-face bonded to the processor device by metal-to-metal bonds and by dielectric-to-dielectric bonds; a first dielectric layer laterally surrounding the first memory device; a redistribution struct...