US Patent Issued to Taiwan Semiconductor Manufacturing on May 27 for "Integrated circuit device and manufacturing method of the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,314,650, issued on May 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit device and manufacturing method of the same" was invented by Ching-Yu Huang (Hsinchu, Taiwan), Wei-Cheng Tzeng (Taipei, Taiwan), Shih-Wei Peng (Hsinchu, Taiwan), Wei-Cheng Lin (Taichung, Taiwan) and Jiann-Tyng Tzeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method is provided, including following operations: identifying a first contact via, a second contact via, or a combination thereof in a first standard cell, wherein the first contact via is coupled between a first active region and a first conductive l...