US Patent Issued to Taiwan Semiconductor Manufacturing on May 27 for "Hybrid bonding technology for stacking integrated circuits" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,843, issued on May 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Hybrid bonding technology for stacking integrated circuits" was invented by Kuo-Ming Wu (Zhubei, Taiwan), Ching-Chun Wang (Tainan, Taiwan), Dun-Nian Yaung (Taipei, Taiwan), Hsing-Chih Lin (Tainan, Taiwan), Jen-Cheng Liu (Hsin-Chu, Taiwan), Min-Feng Kao (Chiayi, Taiwan), Yung-Lung Lin (Taichung, Taiwan), Shih-Han Huang (Kaohsiung, Taiwan) and I-Nan Chen (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, the 3D IC comprises a first IC die comprising a fir...