US Patent Issued to Taiwan Semiconductor Manufacturing on May 27 for "Electronic device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,806, issued on May 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Electronic device and manufacturing method thereof" was invented by Tsung-Fu Tsai (Changhua County, Taiwan), Hou-Ju Huang (Hsinchu County, Taiwan), Shih-Ting Lin (Taipei, Taiwan), Szu-Wei Lu (Hsinchu, Taiwan) and Hung-Wei Tsai (Changhua County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor die and a conductive structure disposed side-by-side and spaced apart from each other through an insulating encapsulant. The conductive structure includes a first conductor laterally covered by the insulatin...