ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,554, issued on May 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Contact structures for semiconductor devices" was invented by Huei-Shan Wu (Keelung, Taiwan) and Yi-Lii Huang (Zhubei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes semiconductor devices and methods for forming the same. A method for forming a semiconductor device includes forming a source/drain structure and forming a gate structure. The method also includes performing a cleaning process on the source/drain structure and the gate structure. The method also includes disposing a portion of a byproduct of the ...