US Patent Issued to Taiwan Semiconductor Manufacturing on May 20 for "Semiconductor wafer processing system and method" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,271, issued on May 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Semiconductor wafer processing system and method" was invented by Kai-Hung Hsiao (Kaohsiung, Taiwan), Chi-Chung Jen (Kaohsiung, Taiwan), Yu-Chun Shen (Tainan, Taiwan), Jhang-Jie Jian (Tainan, Taiwan) and Wen-Chih Chiang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor wafer processing system includes a stocker having an interior surface, a wafer carrier disposed within the stocker, a wafer shelf disposed within the wafer carrier for storing a semiconductor wafer, and a discharge circuit including a first conductor el...