ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,268, issued on May 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).
"Semiconductor fabrication system and method" was invented by Tsung-Sheng Kuo (New Taipei, Taiwan), Chih-Hung Huang (Hsinchu County, Taiwan), Guan-Wei Huang (Hsinchu County, Taiwan), Ping-Yung Yen (Kaohsiung, Taiwan), Hsuan Lee (Tainan, Taiwan) and Jiun-Rong Pai (Jhubei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A system and computer-implemented method are provided for manufacturing a semiconductor electronic device. An assembler receives a jig and a boat supporting a die. The assembler includes a separator that separates the jig into a...