US Patent Issued to Taiwan Semiconductor Manufacturing on May 20 for "Semiconductor die, manufacturing method thereof, and semiconductor package" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,298, issued on May 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor die, manufacturing method thereof, and semiconductor package" was invented by Jie Chen (New Taipei, Taiwan), Hsien-Wei Chen (Hsinchu, Taiwan) and Ming-Fa Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die includes an interconnection structure, conductive pads, a first passivation layer, and a second passivation layer. The conductive pads are disposed over and electrically connected to the interconnection structure. The first passivation layer and the second passivation layer are disposed over the...