US Patent Issued to Taiwan Semiconductor Manufacturing on May 20 for "Semiconductor devices including backside vias and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,310,057, issued on May 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices including backside vias and methods of forming the same" was invented by Che-Lun Chang (Hsinchu, Taiwan), Wei-Yang Lee (Taipei, Taiwan), Chia-Pin Lin (Xinpu Township, Taiwan) and Yuan-Ching Peng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices including backside vias with enlarged backside portions and methods of forming the same are disclosed. In an embodiment, a device includes a first transistor structure in a first device layer; a front-side interconnect structure on a front-side of the...