US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 20 for "Semiconductor device including an isolation region having an edge being covered and manufacturing method for the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,279, issued on May 20, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device including an isolation region having an edge being covered and manufacturing method for the same" was invented by Te-An Chen (Taichung, Taiwan) and Meng-Han Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor device, including a substrate, a first active region in the substrate, a second active region in the substrate and adjacent to the first active region, an isolation region in the substrate and between the first active region and the second active region, a...