ALEXANDRIA, Va., June 16 -- United States Patent no. 12,304,807, issued on May 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Japan).

"Semiconductor device comprising different types of microelectromechanical systems devices" was invented by Hsiang-Fu Chen (Zhubei, Taiwan), Chia-Ming Hung (Taipei, Taiwan) and I-Hsuan Chiu (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device includes an interconnect structure disposed over a semiconductor substrate. A dielectric structure is disposed over the interconnect structure. A first cavity and a second cavity are di...