US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 20 for "Semiconductor device and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,310,027, issued on May 20, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and method of manufacturing the same" was invented by Yu-Ting Tsai (Hsinchu, Taiwan), Ching-Tzer Weng (Tainan, Taiwan), Tsung-Hua Yang (Tainan, Taiwan), Kao-Chao Lin (Chiayi County, Taiwan), Chi-Wei Ho (Tainan, Taiwan) and Chia-Ta Hsieh (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a first gate electrode disposed on the substrate and located in a first region of the semiconductor devic...