US Patent Issued to Taiwan Semiconductor Manufacturing on May 20 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,310,093, issued on May 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and manufacturing method thereof" was invented by Chun-Liang Tai (Hsinchu, Taiwan), Chun-Hsiang Fan (Hsinchu, Taiwan), Ta-Wei Lin (Hsinchu, Taiwan), Shih-Hsiang Chiu (New Taipei, Taiwan), Kuo-Bin Huang (Hsinchu County, Taiwan) and Chieh-Chun Chiang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device is provided. The method comprises the following steps of forming a first semiconductor layer over a substrate, the first semiconductor layer comprising a first semiconducto...