ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,323, issued on May 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package-on-package device" was invented by Ming-Fa Chen (Taichung, Taiwan), Sung-Feng Yeh (Taipei, Taiwan) and Hsien-Wei Chen (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a redistribution structure, a die package on a first side of the redistribution structure including a first die connected to a second die by metal-to-metal bonding and dielectric-to-dielectric bonding, a dielectric material over the first die and the second die and surrounding the first die, and a first through via extending through the dielec...