US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 20 for "Method of manufacturing a semiconductor device and a semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,369, issued on May 20, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of manufacturing a semiconductor device and a semiconductor device" was invented by Ya-Wen Chiu (Tainan, Taiwan), Yi Che Chan (Hsinchu, Taiwan), Lun-Kuang Tan (Hsinchu, Taiwan), Zheng-Yang Pan (Zhubei, Taiwan), Cheng-Po Chau (Tainan, Taiwan), Pin-Chu Liang (Changhua County, Taiwan), Hung-Yao Chen (Hsinchu, Taiwan), De-Wei Yu (Ping-tung, Taiwan) and Yi-Cheng Li (Yunlin County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a method of manufacturing a semiconductor device, a fin structure having a channel region protruding from a...