US Patent Issued to Taiwan Semiconductor Manufacturing on May 20 for "Interconnect structure without barrier layer on bottom surface of via" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,282, issued on May 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Interconnect structure without barrier layer on bottom surface of via" was invented by Tz-Jun Kuo (Hsinchu, Taiwan), Chien-Hsin Ho (Taichung, Taiwan) and Ming-Han Lee (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments and methods of an interconnect structure are provided. The interconnect structure includes a via, a trench that has an overlapping area with a top of the via, and a first layer of conducting material that has an overlapping area with a bottom of the via. The interconnect also includes a second layer of conducti...