US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 20 for "Interconnect structure and method for manufacturing the interconnect structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,312, issued on May 20, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Interconnect structure and method for manufacturing the interconnect structure" was invented by Khaderbad Mrunal Abhijith (Hsinchu, Taiwan), Yu-Yun Peng (Hsinchu, Taiwan), Fu-Ting Yen (Hsinchu, Taiwan), Chen-Han Wang (Hsinchu County, Taiwan), Tsu-Hsiu Perng (Hsinchu County, Taiwan) and Keng-Chu Lin (Ping-Tung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides an interconnect structure and a method for forming an interconnect structure. The method for forming an interconnect structure includes forming a first ...