US Patent Issued to Taiwan Semiconductor Manufacturing on May 20 for "Dual-sided routing in 3D semiconductor system-in-package structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,322, issued on May 20, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Dual-sided routing in 3D semiconductor system-in-package structure and methods of forming the same" was invented by Po-Hao Tsai (Zhongli, Taiwan), Po-Yao Chuang (Hsinchu, Taiwan), Meng-Liang Lin (Hsinchu, Taiwan), Yi-Wen Wu (Xizhi, Taiwan), Shin-Puu Jeng (Hsinchu, Taiwan) and Techi Wong (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is fabricated by attaching a first component to a second component. The first component is assembled by forming a first redistribution structure over a substrate. A through via is...