US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Systems and methods of estimating thermal properties of semiconductor devices" (Taiwanese, American Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,299,369, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Systems and methods of estimating thermal properties of semiconductor devices" was invented by Ching-Yi Lin (Zhubei, Taiwan), Fong-yuan Chang (Hsinchu County, Taiwan), Po-Yu Chen (Baoshan Township, Taiwan), Po-Hsiang Huang (Tainan, Taiwan), Chih-Wei Chang (Hsinchu, Taiwan) and Jyh Chwen Frank Lee (Palo Alto, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes: receiving a layout of an integrated circuit; identifying, based on the layout, at least a first net and at least a second net, wherein the first net extends through the in...