US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Structure and formation method of semiconductor device with carbon-containing conductive structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,541, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Structure and formation method of semiconductor device with carbon-containing conductive structure" was invented by Wei-Hao Liao (Taichung, Taiwan), Hsi-Wen Tien (Xinfeng Township, Hsinchu County, Taiwan), Yu-Teng Dai (Hsinchu County, Taiwan), Chih-Wei Lu (Hsinchu, Taiwan), Hsin-Chieh Yao (Hsinchu, Taiwan) and Hwei-Jay Chu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device structure and a method for forming a semiconductor device structure are provided. The semiconductor device structure includes a substrate and ...