ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,375, issued on May 13, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Slurry composition and method for polishing and integrated circuit" was invented by Ji Cui (Bolingbrook, Ill.), Chi-Jen Liu (Taipei, Taiwan), Liang-Guang Chen (Hsinchu, Taiwan), Kei-Wei Chen (Tainan, Taiwan), Chun-Wei Hsu (Hsinchu, Taiwan), Li-Chieh Wu (Hsinchu, Taiwan), Peng-Chung Jangjian (Hsinchu, Taiwan), Kao-Feng Liao (Hsinchu, Taiwan), Fu-Ming Huang (Changhua County, Taiwan), Wei-Wei Liang (Hsinchu, Taiwan), Tang-Kuei Chang (Tainan, Taiwan) and Hui-Chi Huang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A slurry c...