US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 13 for "Semiconductor structure including scribe line structures and method for fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,105, issued on May 13, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure including scribe line structures and method for fabricating the same" was invented by Wei-Cheng Shen (Tainan, Taiwan), Yi-Hsien Chang (Changhua County, Taiwan), Yi-Heng Tsai (Hsinchu, Taiwan) and Chun-Ren Cheng (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a semiconductor structure includes: providing a first wafer; providing a second wafer having a first surface and a second surface opposite to the first surface; contacting the first surface of the second wafer with the first w...