ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,684, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor packages" was invented by Sheng-Chieh Yang (Hsinchu, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan), Chih-Wei Lin (Hsinchu County, Taiwan) and Yu-Hao Chen (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first integrated circuit and a first waveguide. The first integrated circuit includes an optical coupler. The first waveguide is optically coupled to the optical coupler. In some embodiments, the first waveguide protrudes beyond the optical coupler. In some embodiments, the first waveguide...