US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Semiconductor package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,575, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and method" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Chuei-Tang Wang (Taichung, Taiwan), Shih-Chang Ku (Taipei, Taiwan) and Chien-Yuan Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes a first semiconductor device including a first bonding layer; a second semiconductor device bonded to the first bonding layer of the first semiconductor device; thermal structures disposed beside the second semiconductor device and on the first bonding layer, wherein the thermal structures include a co...