US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Semiconductor devices and methods of manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,633, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of manufacturing thereof" was invented by Shih-Yao Lin (New Taipei, Taiwan), Chih-Han Lin (Hsinchu, Taiwan), Ming-Ching Chang (Hsinchu, Taiwan), Shu-Yuan Ku (Zhubei, Taiwan) and Tzu-Chung Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate. The semiconductor device includes a dielectric fin that is formed over the substrate and extends along a first direction. The semiconductor device includes a gate isolation structure vertically disposed above the diele...