US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Semiconductor devices" (Taiwanese, Malaysian Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,728, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices" was invented by Sai-Hooi Yeong (Perdana, Malaysia), Pei-Yu Wang (Hsinchu, Taiwan) and Chi On Chui (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes: a first nanostructure over a substrate, the first nanostructure including a channel region and a first lightly doped source/drain region, the first lightly doped source/drain region adjacent the channel region; a first epitaxial source/drain region wrapped around four sides of the first lightly doped source/drain region; an interl...