ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,580, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor device and method" was invented by Hsu-Lun Liu (Tainan, Taiwan), Wen-Hsiung Lu (Tainan, Taiwan), Ming-Da Cheng (Taoyuan, Taiwan), Chen-En Yen (Tainan, Taiwan), Cheng-Lung Yang (Kaohsiung, Taiwan) and Kuanchih Huang (Tainan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Some devices included a substrate; and a through via, including a plurality of scallops adjacent the through via in a first region and a plurality of scallops adjacent the through via in a second region, the plurality of scallops having a first depth, the scallo...